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SemiAnalysis
semianalysis.com
2022
28 Jan 2022
27 Jan 2022
Advanced Packaging Part 3 – Intel’s Curious Bet on Thermocompression Bonding, ASM Pacific, Kulicke and Soffa, and Besi TCB Tool Landscapeoriginal ↗
19 Jan 2022
Advanced Packaging Part 2 – Review Of Options/Use From Intel, TSMC, Samsung, AMD, ASE, Sony, Micron, SKHynix, YMTC, Tesla, and Nvidiaoriginal ↗
6 Jan 2022
2021
TSMC Wants To Make Intel Dependent On External Manufacturing – Wafer Supply Agreement Insights For AMD, Apple, Broadcom, Intel, MediaTek, Nvidia, and Qualcommoriginal ↗
23 Dec 2021
TSMC Wants To Make Intel Dependent On External Manufacturing – Wafer Supply Agreement Insights For AMD, Apple, Broadcom, Intel, MediaTek, Nvidia, and Qualcommoriginal ↗
22 Dec 2021
Advanced Packaging Part 1 – Pad Limited Designs, Breakdown Of Economic Semiconductor Scaling, Heterogeneous Compute, and Chipletsoriginal ↗
15 Dec 2021
Amazon Graviton 3 Uses Chiplets & Advanced Packaging To Commoditize High Performance CPUs | The First PCIe 5.0 And DDR5 Server CPUoriginal ↗
2 Dec 2021
Lam Research, Tokyo Electron, JSR Battle It Out In The $5B+ EUV Photoresist, Coater, and Developer Market – CAR vs MOR vs Dry Resistoriginal ↗
18 Nov 2021
Intel Betting The Farm – Shrinking Business, Margins Down For Few Years, But Aggressively Investing $40B-$43B A Year And More With Subsidiesoriginal ↗
22 Oct 2021
Qualcomm RFFE Business Continues Relentless Pace With ultraBAW Filters | >$8B Segment By 2025original ↗
20 Oct 2021
TSMC 3nm Wafer Shipments Pushed Into Q1 2023, 2.5 Years After N5 | TSMC 2nm, Samsung 2nm, And Intel 20A Battle It Out In 2025original ↗
14 Oct 2021
ASML’s EUV Tools Have A Throughput Problem, But Lyncean Has The Answer By Scaling EUV Light Source Power An Order Of Magnitudeoriginal ↗
13 Oct 2021
GlobalFoundries $GFS IPO – Mubadala Lost Over $22.4B, Now They Are Hoping Public Markets Bail Them Outoriginal ↗
6 Oct 2021
30 Sept 2021
Aehr Multi-Wafer Level Burn-in Test for Silicon Carbide and Silicon Photonics Applicationsoriginal ↗
29 Sept 2021
Memory Oligopoly Woes – Micron Says They Will Not Increase Wafer Output In DRAM Or NAND For The Foreseeable Futureoriginal ↗
29 Sept 2021
The Impending Chinese NAND Apocalypse – YMTC 128 Layer NAND Is The First Semiconductor Where China Is Technologically Competitiveoriginal ↗
28 Sept 2021
Kulicke & Soffa Industries, $KLIC, Continued Outperformance Of Wire Bonders And Emerging Supplier in Mini-LED, Micro-LED, And Battery Manufacturingoriginal ↗
27 Sept 2021
Apple CPU Gains Grind To A Halt And The Future Looks Dim As The Impact From The CPU Engineer Exodus To Nuvia And Rivos Starts To Bleed Inoriginal ↗
14 Sept 2021
Advanced Packaging The Size Of Your Monitor | Applied Materials, $AMAT, Modifies Panel PVD Tool For 60x60cm Fan Outs To Usher In A New Age Of Mega Packagesoriginal ↗
13 Sept 2021
No, The iPhone 13 Does Not Have Satellite Internet | Band n53 & Globalstar (GSAT) Explainedoriginal ↗
2 Sept 2021
NXP Semiconductor (NXPI) CFO Sells Nearly 70% Of His Shares As Samsung Acquisition Rumored To Fall Apartoriginal ↗
31 Aug 2021
Rivos Inc | A Chip Off The Old Block? New RISC-V Startup Garners Many Senior CPU Architects From Apple, Google, Marvell, Qualcomm, Intel, and AMDoriginal ↗
30 Aug 2021
A Chip Off The Old Block? New RISC-V Startup Garners Many Senior CPU Architects From Apple, Google, Marvell, Qualcomm, Intel, and AMDoriginal ↗
28 Aug 2021
The Semiconductor Heist Of The Century | Arm China Has Gone Completely Rogue, Operating As An Independent Company With Inhouse IP/R&Doriginal ↗
27 Aug 2021
Tesla Dojo – Unique Packaging and Chip Design Allow An Order Magnitude Advantage Over Competing AI Hardwareoriginal ↗
20 Aug 2021
Kulicke & Soffa Industries, $KLIC, Crushes Earnings But Continues To Sandbag, $6 EPS ’21, $6.75 EPS ’22original ↗
5 Aug 2021
4 Aug 2021
Power Integrations, $POWI, A Premier ESG Play Semiconductor Exposure To Electric Vehicles, Green Energy, And Power Efficiency Regulationsoriginal ↗
3 Aug 2021
Intel Grossly Exaggerates Foundry “Wins” With Qualcomm And Amazon, There Are No Deals For Manufacturing Chipsoriginal ↗
29 Jul 2021
28 Jul 2021
1 Jul 2021
Cerebras Wafer Scale Hardware Crushes High Performance Computing Workloads Including Machine Learning And Beyondoriginal ↗
30 Jun 2021
29 Jun 2021
Qualcomm MWC 2021 – Network Infrastructure And Edge 5G Get Supercharged | FSM200, DU X100 Accelerator, And Range Of Featuresoriginal ↗
29 Jun 2021
Tenstorrent Wormhole Analysis – A Scale Out Architecture for Machine Learning That Could Put Nvidia On Their Back Footoriginal ↗
25 Jun 2021
Morgan Stanley Just Reduced TSMC’s Value By $25B While Demonstrating A Complete Lack of Semiconductor Knowledgeoriginal ↗
23 Jun 2021
Rockley Photonics Will Revolutionize Healthcare By Measuring Biomarkers Such As Glucose With Lasers In The Apple Watchoriginal ↗
22 Jun 2021
17 Jun 2021
Intel’s Trojan Horse into the Foundry Business | Co-packaged Silicon Photonics is Intel’s Path Forward for IDM 2.0original ↗
11 Jun 2021
6 Apr 2021
5 Apr 2021